Senior Product Manager - Thermal Simulation & Optimization Software

About Corintis

Corintis offers innovative microfluidic cooling technologies for AI chips/GPUs and CPUs used in data centers.

We are ranked as Switzerland’s No.1 engineering startup for 2025 and 2026 and employ over 110 people from 35+ nationalities, headquartered on the EPFL Campus in St.

Sulpice, near Lake Geneva.

The Role

Glacierware is Corintis's cooling design automation platform.

It brings together our simulation solvers and optimization algorithms to design cold plates co-designed with the chip, in minutes to hours.

It's at the core of how we work with the world's leading AI chip makers.

We're looking for a Product Manager to own Glacierware's product direction.

This is a senior individual-contributor role, reporting directly to C-level.

You'll set the roadmap for our simulation, algorithms and software team, decide what gets built and in what order, and make sure every release makes thermal engineers faster and more effective.

You'll work at the intersection of physics, software and customers, alongside with Engineering, Solutions, Sales, Marketing, and Customer Success.

Your mission is to turn customer and market needs into a focused product direction that delivers measurable value.

Key Responsibilities

• Define and communicate the 1–3 year product vision and strategy and prioritized roadmap for the simulation suite, making clear trade-offs between customer needs, platform investment, technical debt, and quality.
• Own go-to-market strategy and execution of Corintis software products.
• Lead customer discovery with the engineers who use the product.

Use interviews, surveys, workflow shadowing, site visits, and usability testing to turn recurring problems into validated product opportunities.

• Maintain a single, transparent backlog covering features, bugs, design changes, technical debt, customer requests, and improvement actions.

Review it before each planning cycle, keep near-term items implementation-ready, and give stakeholders clear decisions on scope and timing.

• Partner with Engineering from discovery through release.

Translate customer pain into clear product stories, account for implementation complexity, and define success criteria, release scope, and readiness expectations.

• Lead product communication strategy and positioning, prepare external-facing material and represent Corintis at industry events.
• Track market developments in CFD, multiphysics, cloud simulation, EDA/CAD ecosystems, AI-assisted workflows, chiplets, 3D-IC, and advanced packaging.

Use capability comparisons, SWOT analysis, and market sizing to recommend where Corintis should invest and how the suite should differentiate.

• Define and report product outcomes such as adoption, retention, workflow efficiency, simulation throughput and accuracy, customer satisfaction, and support load.

Requirements

• Bachelor’s or Master’s degree in mechanical engineering, thermal engineering, electrical engineering, physics, computational engineering or a closely related field.
• At least 5 years of product management experience with complex technical engineering software, ideally simulation, CFD or EDA tools.
• Experience taking an product from internal tool or early version to external stakeholders.
• Proven ability to own a multi-quarter strategy, roadmaps, and product lifecycle decisions for a multidisciplinary team (solvers, algorithms, software, UI).
• Experience working with software engineering teams on requirements, requirement decomposition, backlog refinement, iteration planning, validation, and release decisions.
• Proven customer-discovery skills and the technical credibility to work directly with end users, understand their workflows, and balance competing requests without making premature commitments.
• Practical knowledge of simulation workflows and tools used in chip, package, or PCB design, such as Cadence Celsius, Siemens Flotherm, Ansys Icepak, COMSOL, Altair Sim Lab, or equivalent.

You can interpret simulation results and assess model accuracy, mesh quality, material models, and boundary conditions.

• Strong understanding of chip-level thermal engineering, including heat transfer, power dissipation, thermal resistance, hotspot analysis, and package- and board-level effects, as well as coupled thermal-electrical and CFD workflows.
• Understanding of EDA workflows, PCB design, electronics packaging, and how simulation software integrates with CAD and EDA tools.
• Clear written and spoken English and sound judgment under ambiguity.
• Strong interpersonal skills and empathy to work at the intersection of Product, Engineering, Solutions, Sales, Marketing, and Customer Success; understand each team’s perspective, incentives, constraints; and build alignment around shared priorities.
• Ability to travel without restriction to and within the USA, Canada, and Europe.

This Is a Great Fit If You...

• Enjoy technical products, candid prioritization and hands‑on ownership in a growing company
• Value resourcefulness and the ability to deliver results
• Are comfortable making trade‑offs and choosing a pragmatic approach over a more structured, rigorous process when needed.

This Won't Be The Right Role For You If...

• You want a people‑management position
• Are looking for a narrowly scoped feature‑delivery role
• Prefer working fully remotely
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