AI designs the chip. You accelerate its path to production.
The next generation of AI infrastructure needs faster, more efficient optical connections, and reliable semiconductor laser sources to power them.
25FAB is a Swiss semiconductor company building multi-material photonic chips designed with our own artificial intelligence (AI) platform. AI-driven design is already part of how we develop devices, connecting functional requirements with chip design and manufacturing-aware engineering.
Our indium phosphide (InP) laser development is already underway, and we are preparing the next stage of monolithic integration. We are developing laser sources for optical interconnects, including external laser sources (ELS) for co-packaged optics (CPO), with manufacturability and volume production as core design requirements.
We are hiring an experienced process leader to build on this foundation and accelerate process integration, qualification and industrialization.
This is a hands-on leadership role with a clear mission: turn development progress into repeatable processes, qualified devices and a scalable manufacturing pathway.
Why now
We have an active development program, an industrial partner ecosystem and a clear ambition to accelerate commercialization.
The next step requires someone who can connect device requirements, cleanroom execution, process data and manufacturing discipline. You will have the authority to shape that transition, and the responsibility to deliver it.
- Build on existing progress. Advance an active InP development program and help bring its next integration milestones to life.
- Connect AI design with fabrication. Translate AI-designed devices into robust processes, and feed authorized experimental results back into design improvement.
- Own the industrialization roadmap. Shape process development, qualification priorities and the pathway toward volume production.
- Change the future of AI with people who have done it before. Join a team of industry veterans with decades of hands-on experience, and help take real devices from the cleanroom to production.
- Share in the outcome. Competitive Swiss compensation and an equity opportunity, subject to agreed terms.
What you will do
In your first 90 days:
- Review the current status of InP development, device requirements and process readiness
- Identify the highest-priority gaps between current development and repeatable manufacturing
- Refine process integration plans, experiments and acceptance criteria
- Strengthen process documentation, metrology and statistical process control (SPC)
- Lead the next engineering lots and integration trials with the team
Over your first year:
- Accelerate InP laser development toward qualified customer samples and production readiness
- Lead process development and execution for planned monolithic integration
- Improve yield, uniformity, repeatability and reliability
- Resolve process challenges through structured experiments and root-cause analysis
- Work with design engineers to incorporate process constraints and experimental feedback into our AI-assisted design workflow
- Coordinate device characterization, packaging interfaces and reliability testing
- Recruit and mentor a focused InP process team
What you bring
- Typically 10+ years of relevant industrial semiconductor process experience, including substantial hands-on cleanroom work
- Deep expertise in InP and III-V semiconductor laser fabrication
- Experience taking at least one semiconductor laser product from development into qualification or production
- Strong skills in experimental design, process integration, failure analysis and yield improvement
- The ability to assess existing development, identify what limits progress and execute a practical improvement plan
- Experience leading technical work while staying closely involved in engineering decisions
Strong advantages
- Single-frequency, distributed feedback (DFB), distributed Bragg reflector (DBR) or tunable semiconductor lasers
- Etching, passivation, metallization, contacts, facets or optical coatings
- Monolithic integration of InP laser structures and associated process modules
- Laser packaging interfaces, optical coupling and external laser source requirements
- Reliability testing, burn-in and qualification planning, including Telcordia GR-468
- Piezoelectric thin films such as AlScN, BTO or PZT
- CPO, optical interconnects or datacenter transceiver programs
- Transferring processes between development and manufacturing environments
What we offer
- Competitive Swiss compensation and an equity opportunity
- Technical ownership within an active InP laser development program
- A senior leadership role reporting directly to the CEO
- The opportunity to connect our own AI design platform with hands-on semiconductor engineering
- Flexible remote work for design reviews, planning, analysis and coordination, with regular on-site presence in Switzerland as required
- An international working environment
- Relocation and work permit application support, subject to eligibility and applicable approvals
25FAB is an equal-opportunity employer.
Tell us the function. 25FAB designs the chip.
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